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The double-sided packaging technology for the fingerprint ID module IC from Changjiang Electronics Technology Co., Ltd. (JCET

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The double-sided packaging technology for the fingerprint ID module IC from Changjiang Electronics Technology Co., Ltd. (JCET

The double-sided packaging technology for the fingerprint ID module IC from Changjiang Electronics Technology Co., Ltd. (JCET) was named the 9th (2014) Chins Semiconductor Industry’s Innovative Product and Technology.

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LETOU国际米兰·(中国区)官方网站

JCET Posts Record Q3 Revenue, Profit Before Tax Up 29.3% Year-on-Year

LETOU国际米兰·(中国区)官方网站

The “Invisible Engine” Behind Smartphones: JCET’s RFFE Packaging Technology Elevates User Experience

LETOU国际米兰·(中国区)官方网站

JCET Korea Powers Up Phase I Solar Plant to Drive Green Growth

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