letou¹ú¼ÊÃ×À¼¹ÙÍø
Technology & Solutions
Turnkey Services
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Applications
Automotive
Computing
Storage
Edge AI
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Environmental Social & Governance
Quality Management
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
English
ÖÐÎÄ
Home
Technical Solutions
Turnkey
Design
Packaging
Wirebond Packaging
Flip Chip Packaging
Wafer Bumping
Wafer Level Packaging
System-in-Package
MEMS and Sensors Packaging
Power Device Packaging
Advancement of Mainstream Package
Test
Others
¾§Ô²Í¹¿é
¿É¿¿ÐÔÊÔÑéÓëʧЧÆÊÎö
Application fields
Automotive
Computing
Storage
Edge AI
Power & Energy
About JCET
Company Information
Worldwide Locations
Corporate Culture
Leadership Team
Management Team Environmental, Social & Governance
Quality Management
Conflict-Free Minerals Policy
Contact Us
Investor Relations
Financial Reports
News
Join JCET
English
ÖÐÎÄ
Homepage
About Changden
Announcements of All Kinds
ÖÖÖÖͨ¸æ
NOTICE
Announcements of All Kinds
all
all
2025
2024
2023
2022
2021
2020
2019
2018
2017
2016
2015
2014
2013
2012
2011
2010
letou¹ú¼ÊÃ×À¼¹ÙÍø¹ØÓÚ×î½üÎåÄê²»±£´æ±»Ö¤È¯î¿Ïµ²¿·ÖºÍÉúÒâËù½ÓÄÉ´¦·Ö»£»£»£»£»£»£»£»òî¿Ïµ²½·¥µÄͨ¸æ
2018-02-03
letou¹ú¼ÊÃ×À¼¹ÙÍø¹ØÓÚ¡¶ÖйúÖ¤¼à»áÐÐÕþÔÊÐíÏîÄ¿Éó²éÒ»´Î·´ÏìÒâ¼û֪ͨÊé¡·µÄ»Ø¸´Í¨¸æ
2018-02-03
letou¹ú¼ÊÃ×À¼¹ÙÍø¹ØÓÚÉÏ´ÎÕÙļ×ʽðͶ×ÊÏîĿʵÑéÏ£ÍûÇéÐεÄͨ¸æ
2018-02-03
letou¹ú¼ÊÃ×À¼¹ÙÍø¹ØÓÚÓ벿·Ö¿¯Ðй¤¾ßÇ©Êð·Ç¹ûÕæ¿¯ÐÐ¹ÉÆ±¸½Ìõ¼þÉúЧ֮¹É·ÝÈϹºÐÒéÖ®Ôö²¹ÐÒé»òɨ³ýÐÒéµÄͨ¸æ
2018-02-03
letou¹ú¼ÊÃ×À¼¹ÙÍø¹ØÓڷǹûÕæ¿¯ÐÐ¹ÉÆ±Ô¤°¸ÐÞ¶©ÇéÐÎ˵Ã÷µÄͨ¸æ
2018-02-03
letou¹ú¼ÊÃ×À¼¹ÙÍøµÚÁù½ì¶Ê»áµÚ°Ë´ÎÔÝʱ¾Û»á¾öÒéͨ¸æ
2018-02-03
88
89
90
91
92
¡¾ÍøÕ¾µØÍ¼¡¿
¡¾sitemap¡¿